Datrix
As artificial intelligence (AI) and high-performance computing (HPC) continue to redefine the boundaries of data processing, the traditional air-cooling paradigm is reaching its physical limits. At Datrix AI Computing Inc., we recognize that thermal management is no longer a peripheral utility but the core enabler of compute density and operational reliability.
Modern GPUs now exceed 700W per chip. Our CE-certified cooling solutions are designed to handle rack densities exceeding 100kW, ensuring zero thermal throttling for mission-critical AI training.
With global energy regulations tightening, our cooling systems aim for a Power Usage Effectiveness (PUE) of 1.1 or lower, significantly reducing carbon footprints for enterprise data centers.
Our manufacturing facility adheres to rigorous EU safety, health, and environmental protection requirements, providing peace of mind for global procurement teams.
In the current global landscape, enterprise procurement for data center infrastructure has shifted from "lowest cost" to "total cost of ownership (TCO) and compliance." Tier-1 data centers in Europe, North America, and Southeast Asia now mandate CE Certification as a baseline for safety and interoperability. This certification ensures that our cooling modules—ranging from CRAC units to sophisticated liquid-to-liquid heat exchangers—interact safely with the electrical grid and existing fire suppression systems.
Furthermore, the rise of ESG (Environmental, Social, and Governance) reporting means that CTOs are actively seeking manufacturers who provide "Information Gain"—transparent data on energy recovery, fluid dynamics efficiency, and recyclable materials used in the cooling loop.
The industry is currently in a transitional phase from Air-Cooling to Direct-to-Chip (D2C) and Immersion Cooling. Datrix AI Computing Inc. is at the forefront of this roadmap:
Widespread adoption of Rear Door Heat Exchangers (RDHx) and closed-loop liquid-cooled racks that can be deployed in existing air-cooled white spaces.
Total Facility Cooling (TFC) where the primary cooling medium is water or dielectric fluid, eliminating the need for massive fan arrays and reducing noise levels to under 60dB.
Integrating data center cooling with district heating systems, turning the "waste" heat of AI into a valuable resource for local communities.
We provide a multi-tiered approach to thermal management:
A leading Manufacturer & Exporter of High-Performance Infrastructure
Datrix AI Computing Inc. is a professional manufacturer specializing in high-performance AI GPU servers, GPU workstations, and customized computing infrastructure for AI training, deep learning, HPC, cloud computing, and enterprise data centers. With a strong focus on innovation, product reliability, and customer satisfaction, we provide scalable GPU computing solutions for system integrators, distributors, research institutions, and enterprise clients worldwide.
Independent Research & Development with OEM & ODM Services. 100% Pre-shipment Inspection including Burn-in and Functional testing.
Exporting to North America, Europe, Southeast Asia, Middle East, and Australia with 7 years of specialized export expertise.
Logo Customization, Hardware Configuration, Chassis Design, BIOS/Firmware Configuration, and Software Pre-installation.
CE certification ensures that the cooling equipment complies with essential European safety and environmental standards. For data center operators, this means guaranteed electrical safety, electromagnetic compatibility, and a higher level of insurance compliance.
Liquid cooling is significantly more efficient than air because fluids have a much higher heat-carrying capacity. By removing fans and reducing the energy needed for chillers, liquid cooling can lower the PUE from an average of 1.6 down to 1.1 or less.
Yes, Datrix AI provides full OEM/ODM services. Our team of 138 R&D engineers can customize chassis dimensions, thermal loop configurations, and mounting hardware to fit your specific rack environment.
Depending on the customization level, standard CE-certified modules are typically ready for shipment within 4-6 weeks. Large-scale, custom-engineered solutions follow a project-based timeline with 100% IPQC and FQC inspections.